Copper skived fin passive heatsink for 1U server solution up to TDP 205 Watts.
CPU Support
Intel
CPU Socket
Intel Purley EP / EX, Socket LGA 3647
Solution
1U Server and Up
Material
Copper1100 Stacked Fin Heatsink with Vapor Chamber Base
Thermal Grease
Shin-Etsu 7762 Pre-printed
Item Dimension (L inchxW inchxH inch)
4 x 4 x 2
Weight
1.00 lb
Warranty Information
1 Year
CPU Support
Intel
CPU Socket
Intel Purley EP / EX, Socket LGA 3647
Solution
1U Server and Up
Material
Copper1100 Stacked Fin Heatsink with Vapor Chamber Base
Thermal Grease
Shin-Etsu 7762 Pre-printed
Item Dimension (L inchxW inchxH inch)
4 x 4 x 2
Weight
1.00 lb
Warranty Information
1 Year